Philip Ekkels
Drongen,VOV
Summary
Experienced R&D engineer with feeling for a wide range of technologies and materials. Achievements both in startup environment and industry often in cooperation with universities. From this wide knowledge and interest background looking for new challenges as senior R & D engineer.
Overview
23
23
years of professional experience
Work History
Integration engineer
Morrow optics
05.2017 - 05.2024
- Main developer of Morrow optics switchable eyeware technology
- Responsible for key technology process steps that allow seamless integration of flexible electronics into Opthalmic Glasses.
Researcher
UGent
Gent, Belgium
08.2014 - 12.2016
- Technology developer on Ultra-Thin Chip Technology (UTCP) flexible electronics technology for lab to fab technology transition.
Device engineer
TDK-EPCOS
Munich, Germany
03.2011 - 07.2014
- Device engineer for MEMS microphone production in TDK-EPCOS production line
- Focus on electrical characterization, device monitoring and development of measurement methologies.
Researcher
IMEC vzw
Leuven, Belgium
09.2003 - 01.2010
- PhD work focused on microfabrication for RF-MEMS devices
- Focus on technology development.
Researcher
Microflown Technologies/UTwente
Enschede, The Netherlands
01.2001 - 06.2003
- Technology development for startup company Microflown Technology.
- Development of active nanostencil technology in the Utwente MESA+ facility.
Education
PhD - Electrical Engineering
Katholieke Universiteit Leuven
12.2010
M.Sc. - Applied Physics
University of Twente
12.2000
Skills
- Microfabrication
- Characterization
- Computer skills
- Teaching Skills
- Microtechnology
- Process technology
- MEMS
- Design
- Scripting & Tooling
- Python & Scripting
- Device integration
- Flexible electronics
- Project management
- Manufacturing
- Application Integration
- Critical Thinking
- Attention to Detail
Languages
Dutch
native
English
fluent
German
good
French
basic
Patents
- Method for the production of planar structures, Xavier Rottenberg, Phillip Ekkels, Hendrikus Tilmans, Walter De Raedt. Pub. Aug 23, 2011
- Method for producing a microelectromechanical transducer, Marcel Giesen, Thomas Metzger, Phillip Ekkels, Ansgar Schaeufele. Pub. 16 june 2016
- Collective bonding implementing a semi-flexible carrier. Philip Ekkels, Tom Sterken, filled 5 Dec 2016.
- A method to fabricate thinned microchips on a temporary rigid carrier (for improved die placement and bonding). Philip Ekkels, Tom Sterken, filled 6 Dec 2016.
- Electroactive Lens Assembly, Philip Ekkels, Wouter Woestenborghs, Jelle De Smet, April 7, 2022
Personal Information
Date of Birth: 03/11/76
Timeline
Integration engineer
Morrow optics
05.2017 - 05.2024
Researcher
UGent
08.2014 - 12.2016
Device engineer
TDK-EPCOS
03.2011 - 07.2014
Researcher
IMEC vzw
09.2003 - 01.2010
Researcher
Microflown Technologies/UTwente
01.2001 - 06.2003
PhD - Electrical Engineering
Katholieke Universiteit Leuven
M.Sc. - Applied Physics
University of Twente